Superficiem Monte PCB Conventus

Fanway est confidebat SMT socium

Ut diu-term elit of professional superficies monte PCB Conventus Services pro clients per varia industries. Fanway specialitas in electronic contractus vestibulum, nos leverage praecisione SMT apparatu et technica peritus quadrigis ad auxilium cum prototypum consilio, PCBA Testing et High-efficientiam vestibulum. Contact nos directe ad petitionem a quote.

Quid facit SMT opus?

SMT est processus electronics ecclesia. Supplied Electronic components sunt mounted in superficies a PCB (typis circuitu tabula). Est altus automated et flexibile processus, dat manufacturer locis variis components in PCB tabula.

PCB Monte PCB (SMT Technology) Conventus:High Conventus densitas, parva magnitudinem electronic products, lux pondus, volumen et pondus superficiei monte components solum 1/10 eorum traditional per-foraminis components, altum reliability solidarum artus.

Superficiem Mons Technology (SMT) Design et Conventus Processus PCB (typis circuitu tabula) consistat de quinque basic gradus:

I. Praeparatio

First, operator must ensure the work surface clean and tidy, and wear an anti-static wrist strap and ESD-safe clothing to maintain a safe operating environment in order to static electricity free from damaging components.

II. Folder crustulum excudendi

Secundum solidatur crustulum ad PCB est core processus in superficiem monte technology (SMT). Automated Stencil Printers Deposit crustulum et eius deposition species critico influxibus solidatur iuncturam reliability. Per applicationem, ensure crustulum uniformitatem et convenientem volumine ne defectus quasi insufficiens vel nimia depositione. In Fanway, ut effectum deducendi spi (Solder crustulum inspectionem) ut quin crustulum volumen parametri.

III. Place components

Place superficies monte fabrica (SMD) components in typis circuitu tabula (PCB). More SMD components erit positus per automatic collocatione apparatus efficiently et accurate. Et apparatus utitur suctu tips ad colligunt usque components a scutras et pressius positiones eos ad designandum locus in PCB.

IV. Reflowed

Components fixa in PCB per reflows solidatorium. Solder crustulum est calescit ad conflandum, ita firmiter welding in components onto PCB. Hoc processus exigit prostimonia potestate temperatus profile et leo ad curare solidatur iuncturam integritas.

V. Inspectionem

Detailed inspectionem et temptationis non requiritur post reflowering. Perficite omnes components proprie solvuntur et circuitus tabulas munera Northmanni, nec frigus articulis et brevi circuitus.

Post welding processum perficitur, a detailed inspectionem et probatio sunt ferri ut omnes components proprie studium et circuitus tabula munera Northmanni.

Nostrum SMT productio capabilities

* Complete Conventus

* Material Management et Imperium

* Traceability et error praeventionis Management et imperium

* Testing / selige / senescit

* Minimum smt component mole: 01005

* Minimum picem (BGA):0.2mm

* Minimum PCB Location:5050mm

* Maximum PCB Location:910600mm

* Optimus apparatu accurate:+/- 25um

PCBA casibus

* Type: instrumentation
* Numero components: CXXXVI
* Quantitas ex components: MMDCCXXIX
* Duplici-postesque plumbum, liberum reflowerering
* Minimum Package Size: CDII
* Minimum ACUS spacing of components: 0.4Ph qfn

* Type: Industrial Imperium
* Numero components: LXVIII
* Quantitas ex components: MCXXXI
* Geminus-postesque ducunt, liberum reflowering + + single- postes undam solidatorium
* Numerus BGA Soldering: XIII
* Minimum Package Size: CDII
* Minimum ACUS spacing of components: 0.5Ph qfn

* Type: industriae potestate motherboard
* Numero components: CLXXXVII
* Quantitas ex components: MCMXX
* Geminus-postesque ducunt, liberum reflowering + + single- postes undam solidatorium
* Minimum Package Size: CDII
* Minimum ACUS spacing of components: 0.4mm