In global electronics industria subeunda transformative phase, repulsi per celeri progressionem in artificialis intelligentia (ai), 5g connectivity, in Internet de rebus (IOT), et Autelotive of Rerum (IOT), et Autelotive of Rerum (IOT) et Autelotive Electronics. In corde huius transformationis mendacium summus densitate internecect (HDI) PCB foro, quod est experiendo incredibili incrementum.
HDI PCBEst typis circuitu tabulas superiore wiring density per area quam traditum PCB. Sunt featured tenuior vestigium widths et spatia enable magis hospites in minori regio. Mirciae concedit in summus densitas internonnections, parva foramina typice minus quam CL microns in diameter. Caecus et sepultus est vias cann iungo interiorem laminis sine pertineat exterius layers, reducendo tabula in magnitudine et improving signum integritatem. Et PCBs potest habere XX vel magis stratis ad firmamentum universa circuitu consilia.
ExHDI PCBCum altus euismod, reliability et compagitia, id est late in variis industries ut dolor electronics, telecommunication, automotive electronics, medicinae fabrica et industriae automation.
Hic sunt gradus HDI PCBS fundatur in complexitate et technica
| Genus technicae | Structura | Complexio | Applications |
| HDI Paleonemertea Class I | I + n + I | Humilis | Basic Consumer Electronics, simplex cogitationes |
| HDI Paleonemertea Class II | II + N + II | Medium | Advanced Consumer Electronics, Automotive |
| HDI Paleonemertea Class III | III + n + III | Altum | Summus perficientur cogitationes, 5g, AI Systems |
| HDI Paleonemertea Class IV | IV + N + IV | Alte | Secans-Edge Applications, Semiconductor |
